SIEMENS ENCAPSULATION:TO-3PIGBT

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2PCS BUP307 Encapsulation:TO-3P,IGBT (Low forward voltage drop High switching

2PCS BUP307 Encapsulation:TO-3P,IGBT (Low forward voltage drop High switching

Seller: chipsgate Condition: New – Open box Date: November 2, 2017 Price: $ 40.40
2PCS BUP304 Encapsulation:TO-3P,IGBT Low forward voltage drop High switching

2PCS BUP304 Encapsulation:TO-3P,IGBT Low forward voltage drop High switching

Seller: chipsgate Condition: New – Open box Date: November 2, 2017 Price: $ 40.40

Similar Part Numbers

ENCAPSULATION:TO-3PNENCAPSULATION:TO-220ENCAPSULATION:DIP-415KBDENCAPSULATION:DIP-16ENCAPSULATION:DIP-18ENCAPSULATION:DIP-20ABENCAPSULATION:DIP-28ENCAPSULATION:DIP-40ENCAPSULATION:DIP-6ENCAPSULATION:DIP18ENCAPSULATION:DIP-4SIEMENSENCAPSULATION:PLCC-84ENCAPSULATION:PLCC28ENCAPSULATION:MT-200SILICONENCAPSULATION:DIP-28PULSE-WIDTH