SIEMENS ENCAPSULATION:DIP-18

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1PC SIEMENS TLE3101 BIPOLAR IC Chip Encapsulation:DIP-18 lap*industry New October 16, 2017 $13.90
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Similar Part Numbers
ENCAPSULATION:DIP-16ENCAPSULATION:DIP-28ENCAPSULATION:DIP18ENCAPSULATION:DIP-40ENCAPSULATION:DIP-6
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ENCAPSULATION:TO-220ENCAPSULATION:TO-3PIGBTENCAPSULATION:DIP-28PULSE-WIDTHENCAPSULATION:MT-200SILICONAUTOMATION8DI


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